- Manufacturer：
-
- Brainboxes (1)
- DFRobot (1)
- Seeed (5)
- Product Status：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Seeed | HEAT SINK KIT FOR... |
1-3 days |
1,292
In-stock
|
View details Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1-3 days |
37
In-stock
|
View details Get Quote | ||
|
|
Seeed | ALUMINUM ALLOY C... |
1-3 days |
29
In-stock
|
View details Get Quote | ||
|
|
DFRobot | RASPBERRY PI COP... |
1-3 days |
293
In-stock
|
View details Get Quote | ||
|
|
OSEPP Electronics | RASPBERRY PI LOW... |
1-3 days |
436
In-stock
|
View details Get Quote | ||
|
|
OSEPP Electronics | RASPBERRY PI TAL... |
1-3 days |
436
In-stock
|
View details Get Quote | ||
|
Brainboxes | RASPBERRY PI COM... |
1-3 days |
22
In-stock
|
View details Get Quote | ||
|
|
OSEPP Electronics | RASPBERRY PI COP... |
1-3 days |
405
In-stock
|
View details Get Quote | ||
|
|
Seeed | RASPERRY PI COPP... |
1-3 days |
7,113
In-stock
|
View details Get Quote | ||
|
|
Seeed | RPI HEAT SINK KIT... |
1-3 days |
9,826
In-stock
|
View details Get Quote |
