- Manufacturer：
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- BOYD (2)
- Comair Rotron (1)
- CUI Devices (3)
- Product Status：
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- Length：
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- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
3,509
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
1-3 days |
800
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK BLK ANO... |
1-3 days |
644
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK BLK ANO... |
1-3 days |
3,805
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1-3 days |
342
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
400
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
246
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1-3 days |
103
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1-3 days |
5,118
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1-3 days |
9,423
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,959
In-stock
|
View details Get Quote |
