- Manufacturer：
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- BOYD (2)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
6,048
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 FO... |
1-3 days |
2,206
In-stock
|
View details Get Quote |
