- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
1,073
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
1,486
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1-3 days |
2,853
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
838
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
9,825
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1-3 days |
5,975
In-stock
|
View details Get Quote |
