Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Factory Lead Time Stock Action
PF750G BOYD
HTSK-AL-PF750 REV A...
1-3 days
RFQ
702
In-stock
View details Get Quote
HSS12-B20-P95 CUI Devices
HEAT SINK, STAMPI...
1-3 days
RFQ
9,759
In-stock
View details Get Quote
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