- Manufacturer：
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- BOYD (2)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1-3 days |
2,118
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 SO... |
1-3 days |
1,303
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
495
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,972
In-stock
|
View details Get Quote |
