- Manufacturer:
-
- BOYD (4)
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (16)
- Product Status:
-
- Material:
-
- Width:
-
- Attachment Method:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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35 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
1-3 days |
5,261
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
8,515
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
9,779
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 26... |
1-3 days |
9,171
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
8,301
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
5,863
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 19... |
1-3 days |
5,288
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 25... |
1-3 days |
5,904
In-stock
|
View details Get Quote | ||
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
8,010
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK SMT PKG |
1-3 days |
9,455
In-stock
|
View details Get Quote | ||
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
9,533
In-stock
|
View details Get Quote | ||
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
9,492
In-stock
|
View details Get Quote | ||
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
6,431
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
6,568
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK D2PAK TO... |
1-3 days |
5,188
In-stock
|
View details Get Quote |
