- Manufacturer：
-
- BOYD (2)
- CUI Devices (4)
- Material：
-
- Attachment Method：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-218 SO... |
1-3 days |
18,972
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,798
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
609
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,597
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,996
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,210
In-stock
|
View details Get Quote |
