Heat Sinks - IFUSON

Material：

Attachment Method：

Fin Height：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

Filter：

3 Records

Image	Part	Manufacturer	Description	Factory Lead Time		Stock	Action
	HSB02-101007	CUI Devices	HEAT SINK, BGA, 10 ...	1-3 days	RFQ	4,812 In-stock	View details Get Quote
	901-10-1-18-2-B-0	Wakefield Thermal	HEAT SINK ELLIP F...	1-3 days	RFQ	6,719 In-stock	View details Get Quote
	901-10-2-18-2-B-0	Wakefield Thermal	HEAT SINK PIN FIN...	1-3 days	RFQ	7,081 In-stock	View details Get Quote

1 / 1 Page, 3 Records