- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1-3 days |
197
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1-3 days |
129
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
122
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
1,092
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X17.5M... |
1-3 days |
100
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1-3 days |
699
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X21MM D... |
1-3 days |
77
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
1-3 days |
7,243
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X21MM F... |
1-3 days |
7,841
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 23X21MM S... |
1-3 days |
9,931
In-stock
|
View details Get Quote |
