- Manufacturer：
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- BOYD (2)
- CUI Devices (1)
- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
1,684
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
3,265
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
32
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1-3 days |
52
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1-3 days |
7
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
1-3 days |
9,637
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X24.5M... |
1-3 days |
5,569
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X24.5M... |
1-3 days |
7,096
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1-3 days |
12
In-stock
|
View details Get Quote |
