- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
474
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1-3 days |
4,812
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1-3 days |
297
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
358
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
1-3 days |
492
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
1-3 days |
9,485
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X7.5M... |
1-3 days |
7,798
In-stock
|
View details Get Quote |
