- Manufacturer：
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- BOYD (1)
- CUI Devices (3)
- Product Status：
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- Length：
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- Width：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,736
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
400
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
1-3 days |
751
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
9,759
In-stock
|
View details Get Quote | ||
|
BOYD | HEAT SINK |
1-3 days |
5,663
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
5,575
In-stock
|
View details Get Quote |
