- Manufacturer:
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- CUI Devices (14)
- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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15 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,741
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,885
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,548
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,141
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,972
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,973
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
4,992
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,648
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,210
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
4,826
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,972
In-stock
|
View details Get Quote | ||
|
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
1-3 days |
384
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
9,759
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,432
In-stock
|
View details Get Quote |
