- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (3)
- DFRobot (2)
- EDATEC (2)
- Seeed (1)
- Product Status：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,972
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,973
In-stock
|
View details Get Quote | ||
|
|
DFRobot | RASPBERRY PI COP... |
1-3 days |
293
In-stock
|
View details Get Quote | ||
|
|
EDATEC | HEATSINK Raspberry P... |
1-3 days |
369
In-stock
|
View details Get Quote | ||
|
|
EDATEC | HEATSINK Raspberry P... |
1-3 days |
238
In-stock
|
View details Get Quote | ||
|
|
DFRobot | PURE COPPER HEAT... |
1-3 days |
55
In-stock
|
View details Get Quote | ||
|
|
Seeed | ACTIVE HEAT SINK... |
1-3 days |
20
In-stock
|
View details Get Quote | ||
|
|
Micro Connectors, Inc. | COOLING FAN/HS - R... |
1-3 days |
500
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,432
In-stock
|
View details Get Quote | ||
|
Schaffner EMC, Inc. | HEAT SINK |
1-3 days |
5,018
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1-3 days |
6,526
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
1-3 days |
9,634
In-stock
|
View details Get Quote |
