- Manufacturer：
-
- BOYD (1)
- CTS Corporation (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
5,664
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
7,631
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK DUAL VE... |
1-3 days |
8,582
In-stock
|
View details Get Quote |
