- Manufacturer：
-
- BOYD (4)
- Comair Rotron (2)
- CUI Devices (2)
- Product Status：
-
- Length：
-
- Material：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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10 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,548
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
3,559
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,342
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,141
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1-3 days |
8,830
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
3,846
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,679
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 24... |
1-3 days |
8,591
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 24... |
1-3 days |
6,760
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO PKG F... |
1-3 days |
6,801
In-stock
|
View details Get Quote |
