- Manufacturer：
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- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEAT SINK COPPER... |
1-3 days |
17,520
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEAT SINK COPPER... |
1-3 days |
42,525
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1-3 days |
5,388
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
1-3 days |
9,338
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 22... |
1-3 days |
6,445
In-stock
|
View details Get Quote |
