- Manufacturer：
-
- BOYD (4)
- Comair Rotron (2)
- CUI Devices (1)
- Seeed (1)
- Product Status：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
12,459
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
6,000
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1-3 days |
300
In-stock
|
View details Get Quote | ||
|
|
Seeed | EXTREME COOLING ... |
1-3 days |
9,199
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 19... |
1-3 days |
5,288
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1-3 days |
5,904
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,959
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,924
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK SMT PKG |
1-3 days |
9,455
In-stock
|
View details Get Quote |
