- Manufacturer：
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- BOYD (3)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Material Finish：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
1-3 days |
180
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
1-3 days |
44
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
1-3 days |
4
In-stock
|
View details Get Quote | ||
|
|
BOYD | INTEL XEON CPU CO... |
1-3 days |
11
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
1-3 days |
12
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | DUALFLOW HEATSIN... |
1-3 days |
14
In-stock
|
View details Get Quote | ||
|
|
BOYD | INTEL XEON CPU CO... |
1-3 days |
6,289
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | QUADFLOW HEATSIN... |
1-3 days |
8,819
In-stock
|
View details Get Quote | ||
|
BOYD | INTEL XEON CPU CO... |
1-3 days |
4
In-stock
|
View details Get Quote |
