- Manufacturer:
-
- Comair Rotron (1)
- CUI Devices (1)
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 19... |
1-3 days |
9,909
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.2W... |
1-3 days |
6,873
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3 50.8X12.07X0.21MM |
1-3 days |
9,108
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3 76.2X12.07X0.21MM |
1-3 days |
5,988
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3N NANO 50.8X12.07X... |
1-3 days |
7,343
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3N NANO 76.2X12.07X... |
1-3 days |
5,136
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3N NANO 50.8X12.70X... |
1-3 days |
5,456
In-stock
|
View details Get Quote | ||
|
T-Global Technology | PH3N NANO 76.2X12.07X... |
1-3 days |
5,871
In-stock
|
View details Get Quote |
