- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (1)
- Material：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 26... |
1-3 days |
9,171
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1-3 days |
5,537
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
1-3 days |
6,873
In-stock
|
View details Get Quote |
