- Manufacturer：
-
- Cooling Source (2)
- CUI Devices (1)
- Sarnikon (1)
- Type：
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- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1-3 days |
1,672
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | TRANSISTOR HEATS... |
1-3 days |
500
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 28.5X28.5X10MM |
1-3 days |
950
In-stock
|
View details Get Quote | ||
|
|
Cooling Source | 28.5X28.5X10MM |
1-3 days |
13
In-stock
|
View details Get Quote |
