- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
1,505
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
361
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X12.5M... |
1-3 days |
89
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1-3 days |
63
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1-3 days |
157
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X12.5M... |
1-3 days |
6,320
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X12.5M... |
1-3 days |
7,931
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X24.5M... |
1-3 days |
8,225
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1-3 days |
7,792
In-stock
|
View details Get Quote |
