- Manufacturer：
-
- BOYD (1)
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
1,505
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
2,724
In-stock
|
View details Get Quote |
