- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1-3 days |
131
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
8,390
In-stock
|
View details Get Quote |
