Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
V2017B ASSMANN WSW Components
HEATSINK ANOD AL...
1-3 days
RFQ
22,553
In-stock
View details Get Quote
HSB02-101007 CUI Devices
HEAT SINK, BGA, 10 ...
1-3 days
RFQ
4,812
In-stock
View details Get Quote
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