- Manufacturer:
-
- BOYD (6)
- Attachment Method:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEAT SINK 1.75" HIG... |
1-3 days |
1,790
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1-3 days |
909
In-stock
|
View details Get Quote | ||
|
BOYD | HEAT SINK 1.75" HIG... |
1-3 days |
407
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK 1.75" HI R... |
1-3 days |
4,150
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,717
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,533
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,371
In-stock
|
View details Get Quote |
