- Manufacturer:
-
- CUI Devices (2)
- Ohmite (16)
- Wakefield Thermal (10)
- Material:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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29 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1-3 days |
7,352
In-stock
|
View details Get Quote | ||
|
Ohmite | ALUMINUM HEATSIN... |
1-3 days |
6
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,000
In-stock
|
View details Get Quote | ||
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
8,559
In-stock
|
View details Get Quote | ||
|
Ohmite | ALUMINUM HEATSIN... |
1-3 days |
8,369
In-stock
|
View details Get Quote | ||
|
Ohmite | 75MM SINGLE SIDED... |
1-3 days |
5,823
In-stock
|
View details Get Quote | ||
|
Ohmite | 75MM LG, BLK ANODI... |
1-3 days |
9
In-stock
|
View details Get Quote | ||
|
Ohmite | 75MM LG, BLK ANODI... |
1-3 days |
4
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK TO-247 TO... |
1-3 days |
6,204
In-stock
|
View details Get Quote |
