- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
112
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
10
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
67
In-stock
|
View details Get Quote | ||
|
|
BOYD | HTSK-AL-PF750 REV A... |
1-3 days |
702
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
2
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
9,759
In-stock
|
View details Get Quote |
