- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-3 LOW... |
1-3 days |
4,596
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-218/TO... |
1-3 days |
9,203
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
1-3 days |
631
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,730
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,987
In-stock
|
View details Get Quote |
