- Manufacturer：
-
- BOYD (3)
- CUI Devices (4)
- Material：
-
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-218 SO... |
1-3 days |
3,646
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,349
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,245
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,422
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,243
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,994
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,069
In-stock
|
View details Get Quote |
