- Manufacturer：
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- CUI Devices (4)
- Ohmite (1)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
1-3 days |
3,431
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
967
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1-3 days |
3,562
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
2,252
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,846
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1-3 days |
6,320
In-stock
|
View details Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1-3 days |
9,786
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
1-3 days |
5,146
In-stock
|
View details Get Quote |
