- Manufacturer：
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- BOYD (3)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 VE... |
1-3 days |
431
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 VE... |
1-3 days |
8,044
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
1,449
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1-3 days |
190
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1-3 days |
6,870
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,945
In-stock
|
View details Get Quote |
