- Manufacturer:
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- CUI Devices (1)
- Material:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
1,956
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 30.... |
1-3 days |
450
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
7,391
In-stock
|
View details Get Quote |
