- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
3,648
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-218 SO... |
1-3 days |
18,972
In-stock
|
View details Get Quote | ||
|
BOYD | HEAT SINK |
1-3 days |
8,538
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,817
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,210
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
1-3 days |
5,540
In-stock
|
View details Get Quote |
