- Manufacturer：
-
- BOYD (4)
- CUI Devices (1)
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 SO... |
1-3 days |
5,467
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,996
In-stock
|
View details Get Quote | ||
|
BOYD | HEAT SINK |
1-3 days |
8,538
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1-3 days |
8,897
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,817
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
1-3 days |
5,540
In-stock
|
View details Get Quote |
