- Manufacturer：
-
- BOYD (2)
- CTS Corporation (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK CPU W/AD... |
1-3 days |
235
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK CPU W/AD... |
1-3 days |
2,265
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,071
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,477
In-stock
|
View details Get Quote |
