- Manufacturer：
-
- BOYD (1)
- CUI Devices (2)
- Type：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEAT SINK |
1-3 days |
15,410
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1-3 days |
549
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
1-3 days |
6,429
In-stock
|
View details Get Quote |
