- Product Status:
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- Length:
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- Shape:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- 已选条件:
173 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1-3 days |
1,426
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,741
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,962
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEATSINK TO-220 2.9W... |
1-3 days |
1,745
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,055
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
5,367
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,885
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEATSINK TO-220 4W ... |
1-3 days |
2,115
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 33.... |
1-3 days |
1,072
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,548
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,408
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
1,035
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,141
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1-3 days |
502
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1-3 days |
9,460
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1-3 days |
976
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1-3 days |
259
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
976
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1-3 days |
1,505
In-stock
|
查看详情 提交询价 |
