- 品牌：
-
- Adafruit (1)
- CUI Devices (1)
- Type：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Adafruit | MINI ALUMINUM HE... |
1-3 days |
1,172
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1-3 days |
2,970
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
351
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
335
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
9,526
In-stock
|
查看详情 提交询价 |
