- 品牌：
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- Adafruit (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
3,417
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
911
In-stock
|
查看详情 提交询价 | ||
|
|
Adafruit | ALUM HEAT SINK FO... |
1-3 days |
538
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1-3 days |
72
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEAT SINK ANOD AL... |
1-3 days |
780
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1-3 days |
11
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
6,709
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1-3 days |
912
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
6,422
In-stock
|
查看详情 提交询价 | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1-3 days |
14
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
9,108
In-stock
|
查看详情 提交询价 |
