- 品牌：
-
- BOYD (1)
- Comair Rotron (1)
- CUI Devices (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 VE... |
1-3 days |
19,240
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,400
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1-3 days |
8,364
In-stock
|
查看详情 提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
1-3 days |
6,968
In-stock
|
查看详情 提交询价 |
