- 品牌：
-
- CUI Devices (4)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
398
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
1,169
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,281
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,184
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
9,279
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,409
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,512
In-stock
|
查看详情 提交询价 |
