- 品牌：
-
- BOYD (7)
- Comair Rotron (1)
- CUI Devices (1)
- Ohmite (9)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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20 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Ohmite | TO-263 HEAT SINK / P... |
1-3 days |
6,180
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
35,550
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
20,698
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1-3 days |
310
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1-3 days |
7,857
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1-3 days |
9,651
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,911
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1-3 days |
5,261
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,637
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,324
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-202 CL... |
1-3 days |
7,486
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,776
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
8,301
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
5,863
In-stock
|
查看详情 提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1-3 days |
5,904
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,608
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
9,533
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,311
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
9,492
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1-3 days |
6,431
In-stock
|
查看详情 提交询价 |
