- 品牌：
-
- CUI Devices (2)
- Length：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
5 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,512
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,437
In-stock
|
查看详情 提交询价 | ||
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
7,731
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
9,240
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
8,562
In-stock
|
查看详情 提交询价 |
