- 品牌：
-
- CTS Corporation (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
988
In-stock
|
查看详情 提交询价 | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
6,298
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
5,174
In-stock
|
查看详情 提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1-3 days |
7,681
In-stock
|
查看详情 提交询价 |
