- 品牌：
-
- BOYD (1)
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 35X35X23MM... |
1-3 days |
146
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
335
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 35X35X23MM... |
1-3 days |
121
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,123
In-stock
|
查看详情 提交询价 |
