- 品牌:
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- BOYD (4)
- CUI Devices (1)
- Length:
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- Material:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
3,707
In-stock
|
查看详情 提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1-3 days |
2,101
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEATSINK TO-3 BLA... |
1-3 days |
1,846
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEATSINK COPPER ... |
1-3 days |
1,480
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
9,918
In-stock
|
查看详情 提交询价 | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
24
In-stock
|
查看详情 提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
1
In-stock
|
查看详情 提交询价 | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,053
In-stock
|
查看详情 提交询价 | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
6,469
In-stock
|
查看详情 提交询价 |
