- 品牌：
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- BOYD (4)
- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,870
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
43
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1-3 days |
17
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,717
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,342
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,516
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEAT SINK |
1-3 days |
8,072
In-stock
|
查看详情 提交询价 |
